ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005

Packaging Information

MOTOROLA

MMM5063 Advance Information

17

5 Packaging Information

Figure 25. Packaging Information

Marking

(Top View)

MMM5063

AWLYYWW

LLLLLL WW

Tape & Reel Orientation

(Top View)

Tape Width:

16.0 mm

Tape Pitch

12 mm (part to part)

Reel Diameter:

330 mm (13 in)

Component Orientation: Parts are to be orientated with pin 1 side closest to the

tape's round sprocket holes on the tape's trailing edge.

Dry Pack: This device meets Moisture Sensitiviy Level (MSL) 3. Parts will be

shipped in Dry Pack. Parts must be stored at 30°C and 60% relative

humidity with time out of dry pack not to exceed 168 hours.

In the event that parts are not handled or stored within these limits, one of the

following dry out procedures must be completed prior to reflow:

1) 40°C Dry Out: Bake devices at 40°C

at least 192 hours.

2) Room Temperature Dry Out: Store devices at less than 20% Relative

Humidity for at least 500 hours.

Marking:

1st line:

Motorola Logo

2nd Line:

Partnumber coded on 7 characters

3rd Line:

Wafer lot number (coded on 6 characters) followed by wafer num-

ber (coded on 3 digits)

4th Line:

Assy site code (on 1 or 2 characters), followed by Wafer Lot Num-

ber (coded on 1 or 2 characters), followed by Year

(on 2 digits) and Workweek (on 2 digits).

Shipping, Packaging and Marking Information

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com