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HC705RC16GRS/D Datasheet(PDF) 117 Page - NXP Semiconductors |
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HC705RC16GRS/D Datasheet(HTML) 117 Page - NXP Semiconductors |
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117 / 120 page ![]() MC68HC705RC16 — Rev. 3.0 General Release Specification Ordering Information General Release Specification — MC68HC705RC16 Section 14. Ordering Information 14.1 Contents 14.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117 14.3 Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117 14.2 Introduction This section contains ordering instructions for the MC68HC705RC16. 14.3 Ordering Information Table 14-1 provides information in determing order numbers. Table 14-1. MC Order Numbers Package Type Operating Temperature Range MC Order Number 28-Pin Plastic Dual In-Line Package (DIP) 0 to 70 °C MC68HC705RC16P 28-Pin Small Outline Integrated Circuit Package (SOIC) 0 to 70 °C MC68HC705RC16DW 44-Lead Plastic Leaded Chip Carrier Package (PLCC) 0 to 70 °C MC68HC705RC16FN Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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