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AT45DB081E Datasheet(PDF) 89 Page - Renesas Technology Corp |
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AT45DB081E Datasheet(HTML) 89 Page - Renesas Technology Corp |
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89 / 97 page  DS-AT45DB081E-028 Rev. M Page 89 8/16/22 © 2022 Renesas Electronics AT45DB081E Datasheet 28.2 Ordering Codes (Standard DataFlash Page Size) 1. The shipping carrier suffix is not marked on the device. 2. Contact Renesas Electronics for mechanical drawing or Die Sales information. 3. Contact Renesas Electronics for availability. Ordering Code Package Lead Finish Operating Voltage fSCK Device Grade AT45DB081E-SSHN-B [1] 8S1 NiPdAu 1.7 V to 3.6 V 85 MHz Industrial (-40 °C to 85°C) AT45DB081E-SSHN-T[1] AT45DB081E-SHN-B[1] 8S2 AT45DB081E-SHN-T[1] AT45DB081E-MHN-Y[1] 8MA1 AT45DB081E-MHN-T[1] AT45DB081E-UUN-T[1][3] CS8-8A AT45DB081E-DWF[2] DWF Package Type 8S1 8-lead 0.150" wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8S2 8-lead 0.208" wide, Plastic Gull Wing Small Outline (EIAJ SOIC) 8MA1 8-pad (5 x 6 x 0.6mm body), Thermally Enhanced Plastic Ultra Thin Dual Flat No-lead (UDFN) CS8-8A 8-ball (2 x 4 Array) 2.3 x 1.6mm Wafer Level Chip Scale Package DWF Die in Wafer Form |
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