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STM32MP153F Datasheet(PDF) 1 Page - List of Unclassifed Manufacturers |
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STM32MP153F Datasheet(HTML) 1 Page - List of Unclassifed Manufacturers |
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1 / 38 page  OSD32MP15x Datasheet Rev. 7 11/30/2022 Octavo Systems LLC Copyright 2020-2022 Introduction The OSD32MP15x System-in-Package (SiP) devices deliver all the power of a Microprocessor in a package that feels like a Microcontroller in the smallest possible footprint. At their core, the OSD32MP15x devices have the versatile STMicroelectronics STM32MP15x featuring Dual Arm® Cortex® A7 Cores and an Arm® Cortex® M4. Along with the processor, the OSD32MP15x integrates up to 1GB of DDR3L, STPMIC1 Power Management IC, EEPROM, MEMs Oscillator, and passives into a single easy to use BGA package. This integration enables fastest designs with the STM32MP15x by removing the tedious tasks that do not add value to an end system while allowing low cost- manufacturing and miniaturized products. Features • ST STM32MP15x, DDR3L, STPMIC1A, 4KB EEPROM, Oscillator and passive components integrated into a single package • STM32MP15x Features: o Arm® Cortex®-A7 up to 800MHz x2 o Arm® Cortex®-M4 up to 209MHz o NEON ™SIMD Coprocessor x2 o Arm® TrustZone® o USB 2.0 HS + PHY x2 o Ethernet 10/100/1000 o CAN FD/TTCAN x2, UART x4, USART x4, SPI x6, I2C x6, I2S x3, QSPI x2 o eMMC/SD/SDIO Ports x3 o GPIO x148 o 24-bit RGB Display, MIPI DSI o Camera Interface o 22 Channel 16-bit ADC x2, 12-bit DAC x2 o Configurable I/O voltage (1.8V - 3.3V) • Access to all Signals of the STM32MP1 TFBGA 361 Package • Up to 1GB DDR3L • Low Power MEMS Oscillator • Single Voltage Input: 2.8V-5.5V • Integrated Boost: 5.2V • System Power: Buck, Boost, LDOx4, Power Switch x2 Benefits • Integrates over 100 components • Compatible with STM32MP1 development tools and software • Significantly reduces design time • Up to 64% reduction in board space vs discrete implementation • Decreases layout complexity • Wide BGA ball pitch allows low-cost assembly • Simplifies component sourcing • Increased reliability through reduced number of components Package • 18mm X 18mm BGA • 302 Ball, 1mm Pitch • Temp Range: 0 to 85°C, -40 to 85°C OSD32MP15x Block Diagram |
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