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ES9028Q2M Datasheet(PDF) 42 Page - ESS Technology,Inc |
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ES9028Q2M Datasheet(HTML) 42 Page - ESS Technology,Inc |
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42 / 45 page ![]() 0.41 January 16, 2020 ES9028Q2M Datasheet ESS TECHNOLOGY, INC. 109 Bonaventura Dr., San Jose, CA 95134, USA. Tel (408) 643- 8800 • WWW.ESSTECH.COM 42 Example 32-Pin QFN Land Pattern Notes: 1. Thermal vias should be 0.3mm to 0.33mm in diameter, with the barrel plated to 1oz copper. 2. For maximum solder mask in the corners, round the inner corners of each row. 3. Exposed pad should be solder mask defined. 4. Pad width can be reduced to 0.25mm if additional pad to pad clearance is required. 5. For applications where solder loss through vias is a concern, plugging or tenting of the vias should be used. The solder mask diameter for each via should be 0.1mm larger than the via diameter. |
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