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PHN708 Datasheet(PDF) 3 Page - NXP Semiconductors

Part # PHN708
Description  7 N-channel 80 mohm FET array enhancement mode MOS transistors
PDF  12 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PHN708 Datasheet(HTML) 3 Page - NXP Semiconductors

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1998 Mar 17
3
Philips Semiconductors
Product specification
7 N-channel 80 m
Ω FET array
enhancement mode MOS transistors
PHN708
QUICK REFERENCE DATA
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Notes
1. Ts is the temperature at the soldering point of the drain lead.
2. Pulse width and duty cycle limited by maximum junction temperature.
3. When only one FET dissipates.
4. When either combination of FETs 1-5, 1-6, 2-5, 2-7, 3-6 or 3-7 dissipate an equal amount of power.
5. When FET four plus either combination of FETs 1-5, 1-6, 2-5, 2-7, 3-6 or 3-7 dissipate an equal amount of power.
6. When all seven FETs dissipate an equal amount of power.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDS
drain-source voltage (DC)
30
V
VGS
gate-source voltage (DC)
−±20
V
VGSth
gate-source threshold voltage
ID = 1 mA; VDS =VGS
1
2.8
V
ID
drain current (DC)
Ts =80 °C
3.1
A
RDSon
drain-source on-state resistance
ID = 1.5 A; VGS =10V
80
m
Ptot
total power dissipation
Ts =80 °C
1.3
W
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Per FET
VDS
drain-source voltage (DC)
30
V
VGS
gate-source voltage (DC)
−±20
V
ID
drain current (DC)
Ts =80 °C; note 1
3.1
A
IDM
peak drain current
note 2
12.4
A
Ptot
total power dissipation
Ts =80 °C; note 3
1.3
W
Ts =80 °C; note 4
1.13
W
Ts =80 °C; note 5
0.92
W
Ts =80 °C; note 6
0.77
W
Tstg
storage temperature
−55
+150
°C
Tj
operating junction temperature
−55
+150
°C
Source-drain diode
IS
source current (DC)
Ts =80 °C
1.3
A
ISM
peak source current
note 2
5.2
A



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