VIN = 5V

RCF = 8.06kΩ

IOUT = 0.1A

VOUT = 1.8V

fEXT = 2.5MHz

Figure 9-32. Applying and Removing the

Synchronization Signal (PFM)

VIN = 5V

RCF = 8.06kΩ

IOUT = 1A

VOUT = 1.8V

fEXT = 2.5MHz

Figure 9-33. Applying and Removing the

Synchronization Signal (FPWM)

9.4 Power Supply Recommendations

The TPSM8281x device family has no special requirements for the input power supply. The output current of the

input power supply needs to be rated according to the supply voltage, output voltage, and output current of the

TPSM8281x.

9.5 Layout

9.5.1 Layout Guidelines

A proper layout is critical for the operation of any switched mode power supply, especially at high switching

frequencies. Therefore, the PCB layout of the TPSM8281x demands careful attention to ensure best

performance. A poor layout can lead to issues like bad line and load regulation, instability, increased EMI

radiation, and noise sensitivity. Refer to the Five Steps to a Great PCB Layout for a Step-Down Converter analog

design journal for a detailed discussion of general best practices. Specific recommendations for the device are

listed below.

• The input capacitor must be placed as close as possible to the VIN and GND pins of the device. This is the

most critical component placement. Route the input capacitor directly to the VIN and GND pins avoiding vias.

• Place the output capacitor ground close to the VOUT and GND pins and route it directly avoiding vias.

• Place the FB resistors, R1 and R2, and the feedforward capacitor CFF close to the FB pin and place CSS

close to the SS/TR pin to minimize noise pickup.

• Place the RCF resistor close to the COMP/FSET pin to minimize the parasitic capacitance.

• The recommended layout is implemented on the EVM and shown in the TPSM82810EVM-089 Evaluation

Module User's Guide and in Section 12.2.

• The recommended land pattern for the TPSM8281x is shown at the end of this data sheet. For best

manufacturing results, it is important to create the pads as solder mask defined (SMD), when some pins

(such as VIN, VOUT, and GND) are connected to large copper planes. Using SMD pads keeps each pad the

same size and avoids solder pulling the device during reflow.

www.ti.com

TPSM82810, TPSM82813

SLUSDN6B – SEPTEMBER 2019 – REVISED JULY 2024

Copyright © 2024 Texas Instruments Incorporated

Submit Document Feedback

23

Product Folder Links: TPSM82810 TPSM82813