LM2831

SNVS422D – AUGUST 2006 – REVISED SEPTEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN

–0.5

7

V

FB Voltage

–0.5

3

V

EN Voltage

–0.5

7

V

SW Voltage

–0.5

7

V

Junction Temperature(3)

150

°C

Soldering Information

Infrared or Convection Reflow (15 sec)

220

°C

Storage Temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

3

5.5

V

Junction Temperature

–40

125

°C

6.4 Thermal Information

LM2831

THERMAL METRIC(1)

SOT-23 (DBV

WSON (NGG)

UNIT

5 PINS

6 PINS

RθJA

Junction-to-ambient thermal resistance(2)

163.4

54.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance(2)

114.4

50.8

°C/W

RθJB

Junction-to-board thermal resistance

26.8

29.2

°C/W

ψJT

Junction-to-top characterization parameter

12.4

0.6

°C/W

ψJB

Junction-to-board characterization parameter

26.2

29.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

9.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

Applies for packages soldered directly onto a 3” × 3” PC board with 2 oz. copper on 4 layers in still air.

4

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