4

LM3550

SNVS569C – MAY 2009 – REVISED OCTOBER 2016

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Copyright © 2009–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 145°C (typical) and

disengages at TJ = 125°C (typical). The thermal shutdown is specified by design.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

VIN to GND

–0.3

6

V

VOUT, LED−, FB to GND

–0.3

6

V

SDA, SCL, STROBE, FET_CON, EOC, ALD/TEMP, IND to GND

–0.3

6

V

Continuous power dissipation(4)

Internally limited

Junction temperature, TJ-MAX

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

The LED pin has a machine model ESD rating of 150 V.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Machine model(2)

±200

(1)

All voltages are with respect to the potential at the GND pin.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

Input voltage

2.7

5.5

V

Junction temperature, TJ

–30

125

°C

Ambient temperature, TA

–30

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

LM3550

UNIT

NHU (UQFN)

16 PINS

RθJA

Junction-to-ambient thermal resistance

60.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

30.5

°C/W

RθJB

Junction-to-board thermal resistance

28.1

°C/W

ψJT

Junction-to-top characterization parameter

0.7

°C/W

ψJB

Junction-to-board characterization parameter

28.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

17.8

°C/W