LP5562TMXSLASHNOPB datasheet(43/52 Pages) TI2

43 / 52 page

VDD

CLK

32K

ADDR

SEL1

ADDR

SEL0

GND

SDA

SCL

EN/

VCC

HOST

BLUE

GREEN

RED

WHITE

VDD

GND

LP5562

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SNVS820B – APRIL 2013 – REVISED DECEMBER 2016

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9 Power Supply Recommendation

The LP5562 is intended to operate from a single cell lithium-ion battery or battery charger up to 5.5 V. The

resistance of the input supply rail should be low enough so that the input current transient does not cause too

high drop at the LP5562 VDD pin. If the input supply is also powering the LEDs and is connected by using long

wires additional bulk capacitance may be required in addition to the ceramic bypass capacitors in the VDD / LED

supply line.

10 Layout

10.1 Layout Guidelines

Figure 46 is a layout recommendation for the LP5562 used to demonstrate the principles of good layout. This

example is for a 2-layer PCB and a single LP5562 device. This layout can be adapted to the actual application

layout if/where possible. If multiple LP5562 devices are used in the application then not all the ADDRSEL pins

will be tied to ground. In that case a PCB using HDI process is needed to route ADDRSEL0 and GND bumps.

The VDD decoupling cap must be placed close to VDD bump, and the traces for W, R, G, and B bumps must be

sized to carry 25.5 mA.

10.2 Layout Example

Figure 46. LP5562 Layout Example

LP5562TMX/NOPB Datasheet(PDF) 43 Page - Texas Instruments