LMH6672

SNOS957H – APRIL 2001 – REVISED AUGUST 2014

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6 Specifications

6.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIN Differential

±1.2

V

Output Short Circuit Duration

See(2)

Supply Voltage (V+

− V−)

13.2

V

V+ +0.8

Voltage at Input/Output pins

V

V−

−0.8

Junction Temperature

+150(3)

°C

Soldering Information

Infrared or Convection (20 sec)

235

°C

Wave Soldering (10 sec)

260

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Shorting the output to either supply or ground will exceed the absolute maximum TJ and can result in failure.

(3)

The maximum power dissipation is a function of TJ(MAX), RθJA and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) − TA)/RθJA. All numbers apply for packages soldered directly onto a PC board.

6.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

−65

+150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

2

2000

pins(2)

V(ESD)

Electrostatic discharge(1)

V

Machine Model (MM)l(3)

200

(1)

Human body model, 1.5 k

Ω in series with 100 pF. Machine model, 200 Ω in series with 100 pF.

(2)

JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process.

(3)

JEDEC document JEP157 states that 200-V MM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply Voltage (V+ - V−)

±2.5

±6.5

V

Operating Temperature Range

−40

150

°C

6.4 Thermal Information

SOIC

SO PowerPAD

Package D

Package DDA

THERMAL METRIC(1)

UNIT

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

172

58.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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