SPC563M60L7 datasheet(127/128 Pages) STMICROELECTRONICS

127 / 128 page

DocID14642 Rev 12

127/128

SPC563M64x, SPC563M60x

Revision history

127

30-Mar-2016

(cont.)

Removed Section “LQFP176 pinout (SPC563M60)”

Removed Section: “LBGA208 ballmap (SPC563M64)”

In Table 4: SPC563Mx signal properties:

– removed “LQFP100” and “LBGA208” columns

– removed “VDDE7” from “Voltage/Pad Type” column

– removed row related to “CLKOUT”,“VDDE5”, and “VDDE7”

– removed note “Not available on 1 MB version of 176-pin package”

In Table 6: Signal details, updated description of “CLKOUT”

In Table 7: SPC563Mx Power/Ground Segmentation:

– removed “100-LQFP Pin Number” and “208-BGA Pin Number” columns

– removed row related to “VDDE5”

– removed “VDDE7” from “Power Segment” column

Removed Table: “Thermal characteristics for 100-pin LQFP”

Removed Table: “Thermal characteristics for 208-pin LBGA”

In Table 15: PMC electrical characteristics, removed not “The limits will be reviewed...”

In Table 23: DC electrical specifications:

– removed “IDD7” from Symbol column

– removed “VDDE7” from Conditions column

– removed note “These specifications are design target...” and “TBD: To Be Defined.”

In Table 28: PLLMRFM electrical specifications (VDDPLL =1.14 V to 1.32 V, VSS =

VSSPLL = 0 V, TA = TL to TH), removed note “All values given are initial design...”

In Table 29: Temperature sensor electrical characteristics change accuracy parameter

from +/-10 to +/- 20

In Table 31: APC, RWSC, WWSC settings vs. frequency of operation, added note

“Maximum Frequency includes FM modulation.”

In Table 34: Pad AC specifications (5.0 V), removed note “TBD: To Be Defined.”

Removed Section “LQFP100”

Removed Section “LBGA208”

Updated Figure 29: Commercial product code structure

Table 45. Document revision history (continued)

Date

Revision

Changes

SPC563M60L7 Datasheet(PDF) 127 Page - STMicroelectronics