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MPC852T Datasheet(PDF) 75 Page - Freescale Semiconductor, Inc |
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MPC852T Datasheet(HTML) 75 Page - Freescale Semiconductor, Inc |
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75 / 80 page  MPC852T PowerQUICC™ Hardware Specifications, Rev. 4 Freescale Semiconductor 75 Mechanical Data and Ordering Information 16.2 Mechanical Dimensions of the PBGA Package For more information on the printed-circuit board layout of the PBGA package, including thermal via design and suggested pad layout, refer to Plastic Ball Grid Array Application Note (order number: AN1231) that is available from your local Freescale sales office. Figure 65 shows the mechanical dimensions of the PBGA package. Figure 65. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package Note: Solder sphere composition is 95.5%Sn 45%Ag 0.5%Cu for MPC852TVRXXX. Solder sphere composition is 62%Sn 36%Pb 2%Ag for MPC852TZTXXX. 1. All dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M—1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is defined by the spherical crowns of the solder balls. Notes: |
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