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QST608AB1 Datasheet(PDF) 46 Page - STMicroelectronics |
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QST608AB1 Datasheet(HTML) 46 Page - STMicroelectronics |
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46 / 51 page ![]() Part numbering QST108 46/51 8 Part numbering For a list of available options (speed, package, etc.) or for further information on any aspect of this device, please contact your nearest ST Sales Office. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. Table 38. Ordering information scheme Example: QST 1 08 K T 6 Device type QST = Capacitive touch sensor Device sub-family 1: QTouch (3 to 5 V) 5: QMatrix (3 to 5 V) 6: QSlide/QWheel (3 to 5 V) 11: QTouch (1.8 to 3.6 V) 15: QMatrix (1.8 to 3.6 V) 16: QSlide/QWheel (1.8 to 3.6 V) Channel count Number of channels Pin count A: 8 pins S: 44 pins Y: 16 pins C: 48 pins K: 32 pins M: 80 pins Package B: DIP (dual in-line) H: BGA (ball grid array) M: SO (small outline) N: TSSOP (thin-shrink small outline package) T: LQFP (thin quad flat) U: QFN (dual quad flat no lead) Temperature range 0: +25°C 6: –40°C to +85°C 1: 0 to +70°C 7: –40°C to +105°C 5: –10°C to +85°C 9: –40°C to + 125°C |
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