LTC2301/LTC2305

23

23015f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

MS Package

12-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1668 Rev Ø)

DE/UE Package

12-Lead Plastic DFN (4mm × 3mm)

(Reference LTC DWG # 05-08-1695)

MSOP (MS12) 1107 REV Ø

0.53 0.152

(.021 .006)

SEATING

PLANE

0.18

(.007)

1.10

(.043)

MAX

0.22 – 0.38

(.009 – .015)

TYP

0.86

(.034)

REF

0.650

(.0256)

BSC

12 11 10 9 8 7

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.254

(.010)

0 – 6 TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

0.889 0.127

(.035 .005)

RECOMMENDED SOLDER PAD LAYOUT

0.42 0.038

(.0165 .0015)

TYP

0.65

(.0256)

BSC

4.039 0.102

(.159 .004)

(NOTE 3)

0.1016 0.0508

(.004 .002)

12 3 4 5 6

3.00 0.102

(.118 .004)

(NOTE 4)

0.406 0.076

(.016 .003)

REF

4.90 0.152

(.193 .006)

4.00 ±0.10

(2 SIDES)

3.00 ±0.10

(2 SIDES)

NOTE:

1. DRAWING PROPOSED TO BE A VARIATION OF VERSION

(WGED) IN JEDEC PACKAGE OUTLINE M0-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

0.40 ± 0.10

BOTTOM VIEW—EXPOSED PAD

1.70 ± 0.10

0.75 ±0.05

R = 0.115

TYP

R = 0.05

TYP

2.50 REF

1

6

12

7

PIN 1 NOTCH

R = 0.20 OR

0.35 × 45°

CHAMFER

PIN 1

TOP MARK

(NOTE 6)

0.200 REF

0.00 – 0.05

(UE12/DE12) DFN 0806 REV D

2.50 REF

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

2.20 ±0.05

0.70 ±0.05

3.60 ±0.05

PACKAGE

OUTLINE

3.30 ±0.10

0.25 ± 0.05

0.50 BSC

1.70 ± 0.05

3.30 ±0.05

0.50 BSC

0.25 ± 0.05