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PIC16F722-E/ML Datasheet(PDF) 220 Page - Microchip Technology

Part # PIC16F722-E/ML
Description  28/40/44-Pin Flash Microcontrollers with nanoWatt XLP Technology
PDF  302 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC16F722-E/ML Datasheet(HTML) 220 Page - Microchip Technology

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PIC16F72X/PIC16LF72X
DS41341E-page 220
© 2009 Microchip Technology Inc.
23.5
Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C
≤ TA ≤ +125°C
Param
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01
θJA
Thermal Resistance Junction to Ambient
60
°C/W
28-pin SPDIP package
80
°C/W
28-pin SOIC package
90
°C/W
28-pin SSOP package
27.5
°C/W
28-pin UQFN 4x4mm package
27.5
°C/W
28-pin QFN 6x6mm package
47.2
°C/W
40-pin PDIP package
46
°C/W
44-pin TQFP package
24.4
°C/W
44-pin QFN 8x8mm package
TH02
θJC
Thermal Resistance Junction to Case
31.4
°C/W
28-pin SPDIP package
24
°C/W
28-pin SOIC package
24
°C/W
28-pin SSOP package
24
°C/W
28-pin UQFN 4x4mm package
24
°C/W
28-pin QFN 6x6mm package
24.7
°C/W
40-pin PDIP package
14.5
°C/W
44-pin TQFP package
20
°C/W
44-pin QFN 8x8mm package
TH03
TJMAX
Maximum Junction Temperature
150
°C
TH04
PD
Power Dissipation
—
W
PD = PINTERNAL + PI/O
TH05
PINTERNAL Internal Power Dissipation
—
W
PINTERNAL = IDD x VDD(1)
TH06
PI/O
I/O Power Dissipation
—
W
PI/O =
Σ (IOL * VOL) + Σ (IOH * (VDD - VOH))
TH07
PDER
Derated Power
—
W
PDER = PDMAX (TJ - TA)/
θJA(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature
3: TJ = Junction Temperature



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