PIC16F722-ESLASHML datasheet(225/302 Pages) MICROCHIP

225 / 302 page

DS41341E-page 225

PIC16F72X/PIC16LF72X

TABLE 23-2:

OSCILLATOR PARAMETERS

FIGURE 23-7:

CLKOUT AND I/O TIMING

Standard Operating Conditions (unless otherwise stated)

Operating Temperature

-40°C

≤ TA ≤ +125°C

Param

No.

Sym.

Characteristic

Freq.

Tolerance

Min.

Typ†

Max.

Units

Conditions

OS08

HFOSC

Internal Calibrated HFINTOSC

Frequency(2)

±2%

—

16.0

—

MHz

0°C

≤ TA ≤ +85°C,

VDD

≥ 2.5V

±5%

—

16.0

—

MHz

-40°C

≤ TA ≤ +125°C

OS08A MFOSC

Internal Calibrated MFINTOSC

Frequency(2)

±2%

—

500

—

kHz

0°C

≤ TA ≤ +85°C

VDD

≥ 2.5V

±5%

—

500

kHz

-40°C

≤ TA ≤ +125°C

OS10*

TIOSC ST HFINTOSC Wake-up from Sleep

Start-up Time

——

μs

MFINTOSC Wake-up from Sleep

Start-up Time

—

μs

These parameters are characterized but not tested.

†

Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are

not tested.

Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on

characterization data for that particular oscillator type under standard operating conditions with the device executing

code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current

consumption. All devices are tested to operate at “min” values with an external clock applied to the OSC1 pin. When an

external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.

2: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as

possible. 0.1

μF and 0.01 μF values in parallel are recommended.

3: By design.

FOSC

CLKOUT

I/O pin

(Input)

I/O pin

(Output)

OS11

OS19

OS13

OS15

OS18, OS19

OS20

OS21

OS17

OS16

OS14

OS12

OS18

Old Value

New Value

Write

Fetch

Read

Execute

Cycle

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