PIC16F722-ESLASHML datasheet(231/302 Pages) MICROCHIP

231 / 302 page

DS41341E-page 231

PIC16F72X/PIC16LF72X

TABLE 23-8:

PIC16F72X A/D CONVERSION REQUIREMENTS

FIGURE 23-12:

PIC16F72X A/D CONVERSION TIMING (NORMAL MODE)

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +125°C

Param

No.

Sym.

Characteristic

Min.

Typ†

Max.

Units

Conditions

AD130* TAD

A/D Clock Period

1.0

—

9.0

μsTOSC-based

A/D Internal RC Oscillator

Period

1.0

2.0

6.0

μs

ADCS<1:0> = 11 (ADRC mode)

AD131

TCNV

Conversion Time (not including

Acquisition Time)(1)

—10.5—

TAD

Set GO/DONE bit to conversion

complete

AD132* TACQ

Acquisition Time

—

1.0

—

μs

These parameters are characterized but not tested.

†

Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not

tested.

Note 1: The ADRES register may be read on the following TCY cycle.

AD131

AD130

BSF ADCON0, GO

A/D CLK

A/D Data

ADRES

ADIF

Sample

OLD_DATA

Sampling Stopped

DONE

NEW_DATA

Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the

SLEEP

instruction to be executed.

1 TCY

AD134

(TOSC/2(1))

1 TCY

AD132

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