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PIC16F722-E/ML Datasheet(PDF) 301 Page - Microchip Technology |
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PIC16F722-E/ML Datasheet(HTML) 301 Page - Microchip Technology |
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301 / 302 page ![]() © 2009 Microchip Technology Inc. DS41341E-page 301 PIC16F72X/PIC16LF72X PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office . PART NO. X /XX XXX Pattern Package Temperature Range Device Device: PIC16F722, PIC16LF722, PIC16F722T, PIC16LF722T(1) PIC16F723, PIC16LF723, PIC16F723T, PIC16LF723T(1) PIC16F724, PIC16LF724, PIC16F724T, PIC16LF724T(1) PIC16F726, PIC16LF726, PIC16F726T, PIC16LF726T(1) PIC16F727, PIC16LF727, PIC16F727T, PIC16LF727T(1) Temperature Range: I= -40 °C to +85°C E= -40 °C to +125°C MV = Micro Lead Frame (UQFN) Package: ML = Micro Lead Frame (QFN) P = Plastic DIP PT = TQFP (Thin Quad Flatpack) SO = SOIC SP = Skinny Plastic DIP SS = SSOP Pattern: 3-Digit Pattern Code for QTP (blank otherwise) Examples: a) PIC16F722-E/SP 301 = Extended Temp., skinny PDIP package, QTP pattern #301 b) PIC16F722-I/SO = Industrial Temp., SOIC package Note 1: T = In tape and reel. |
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