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IMX53CEC Datasheet(PDF) 150 Page - Freescale Semiconductor, Inc |
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IMX53CEC Datasheet(HTML) 150 Page - Freescale Semiconductor, Inc |
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150 / 204 page  i.MX53xD Applications Processors for Consumer Products, Rev. 2 150 Freescale Semiconductor Package Information and Contact Assignments 6 Package Information and Contact Assignments This section includes the contact assignment information and mechanical package drawing. 6.1 19x19 mm Package Information This section contains the outline drawing, signal assignment map, ground/power reference ID (by ball grid location) for the 19 × 19 mm, 0.8 mm pitch package. 6.1.1 Case TEPBGA-2, 19 x 19 mm, 0.8 mm Pitch, 23 x 23 Ball Matrix Figure 98 shows the top view of the 19 ×19 mm package, Figure 99 shows the bottom view and the ball location (529 solder balls) of the 19 ×19 mm package, and Figure 100 shows the side view of the 19×19 mm package. Figure 98. 19 x 19 mm Package Top View |
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