MPC5673K datasheet(73/140 Pages) FREESCALE

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Electrical characteristics

MPC5675K Microcontroller Data Sheet, Rev. 4

Preliminary—Subject to Change Without Notice

Freescale Semiconductor

3.4

Thermal characteristics

3.4.1

General notes for specifications at maximum junction temperature

An estimation of the chip junction temperature, TJ, can be obtained from Equation 1:

TJ =TA +(RJA ×PD)

Eqn. 1

where:

= ambient temperature for the package (oC)

RJA = junction to ambient thermal resistance (

oC/W)

= power dissipation in the package (W)

The junction to ambient thermal resistance is an industry standard value that provides a quick and easy

estimation of thermal performance. Unfortunately, there are two values in common usage: the value

determined on a single layer board and the value obtained on a board with two planes. For packages such

as the PBGA, these values can be different by a factor of two. Which value is closer to the application

depends on the power dissipated by other components on the board. The value obtained on a single layer

Table 13. Thermal characteristics for package options1

NOTES:

1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.

No.

Symbol

Parameter

Conditions

Value

Unit

BGA

257

BGA

473

1RJA

CC Thermal resistance junction-to-ambient

natural convection2

2 Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board

meets JEDEC specification for this package.

Single layer board – 1s

 40

 34 °C/W

2RJA

CC Thermal resistance junction-to-ambient

natural convection2

Four layer board – 2s2p

 22

 20 °C/W

3RJMA CC Thermal resistance

junction-to-moving-air ambient2

@ 200 ft./min.,

single layer board – 1s

 32

 26 °C/W

4RJMA CC Thermal resistance

junction-to-moving-air ambient2

@ 200 ft./min.,

four layer board – 2s2p

 18

 17 °C/W

5RJB

CC Thermal resistance junction-to-board3

3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC

specification for the specified package.

—

 10

 10 °C/W

6RJC

CC Thermal resistance junction-to-case4

4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate

temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.

—

 6

°C/W



CC Junction-to-package-top natural

convection5

5 Thermal characterization parameter indicating the temperature difference between the package top and the

junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization

parameter is written as Psi-JT.

—

 2

 2°C/W

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