MPC5673K datasheet(96/140 Pages) FREESCALE

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MPC5675K Microcontroller Data Sheet, Rev. 4

Preliminary—Subject to Change Without Notice

Electrical characteristics

Freescale Semiconductor

3.19

DRAM pad specifications

This section specifies the electrical characteristics of the DRAM pads. Please refer to the tables in

Section 2.2, Pin descriptions, for a cross reference between package pins and pad types.

DRAM pads feature list:

•

Driver

— Configurable to support LPDDR half strength, LPDDR full strength, DDR1, DDR2 half

strength, DDR2 full strength, and SDR modes.

— VDD_HV_DRAM Range of

– 1.8 V nominal

– 2.5 V nominal

– 3.3 V nominal

•

Receiver

— Differential or pseudo-differential input buffer in all DRAM pads

Table 45. PDI pads AC electrical specifications (VDD_HV_PDI = 1.8 V)

No.

Name

Prop. Delay (ns)

 H/H  L1

NOTES:

 H signifies low-to-high propagation delay and H  L signifies high-to-low propagation delay.

Rise/Fall Edge

(ns)

Drive Load

(pF)

Drive/Slew

Rate Select

Min

Max

Min

Max

MSB, LSB

PDI Medium

—

5.5/3.5

2/1

—

12/5.5

7.2/2.3

200

49/17

13/6

60/23

21/9.2

200

102/32

26/12

119/39

35/16

200

722/216

172/85

772/237

191/90

200

PDI Fast

—

10/10

2/2

—

15/15

6.2/6.2

200

15/15

4.5/4.5

22/22

7.1/7.1

200

24/24

7.5/7.5

33/33

12/12

200

66/66

24/24

84/84

31/31

200

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