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IS61WV6416DBLL/DBLS Datasheet(PDF) 1 Page - Integrated Silicon Solution, Inc |
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IS61WV6416DBLL/DBLS Datasheet(HTML) 1 Page - Integrated Silicon Solution, Inc |
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1 / 21 page ![]() Integrated Silicon Solution, Inc. — www.issi.com 1 Rev. A 11/18/2010 Copyright©2010IntegratedSiliconSolution,Inc.Allrightsreserved.ISSIreservestherighttomakechangestothisspecificationanditsproductsatanytimewithout notice.ISSIassumesnoliabilityarisingoutoftheapplicationoruseofanyinformation,productsorservicesdescribedherein.Customersareadvisedtoobtainthelat- estversionofthisdevicespecificationbeforerelyingonanypublishedinformationandbeforeplacingordersforproducts. IntegratedSiliconSolution,Inc.doesnotrecommendtheuseofanyofitsproductsinlifesupportapplicationswherethefailureormalfunctionoftheproductcanreason- ablybeexpectedtocausefailureofthelifesupportsystemortosignificantlyaffectitssafetyoreffectiveness.Productsarenotauthorizedforuseinsuchapplications unlessIntegratedSiliconSolution,Inc.receiveswrittenassurancetoitssatisfaction,that: a.)theriskofinjuryordamagehasbeenminimized; b.)theuserassumeallsuchrisks;and c.)potentialliabilityofIntegratedSiliconSolution,Incisadequatelyprotectedunderthecircumstances IS61WV6416DALL/DALS IS61WV6416DBLL/DBLS IS64WV6416DBLL/DBLS FEATURES HIGHSPEED:(IS61/64WV6416DALL/DBLL) • High-speedaccesstime:8,10,12,20ns • LowActivePower:135mW(typical) • LowStandbyPower:12µW(typical) CMOSstandby LOWPOWER:(IS61/64WV6416DALS/DBLS) • High-speedaccesstime:25,35ns • LowActivePower:55mW(typical) • LowStandbyPower:12µW(typical) CMOSstandby • Singlepowersupply —Vdd1.65Vto2.2V(IS61WV6416DAxx) —Vdd2.4Vto3.6V(IS61/64WV6416DBxx) • Fullystaticoperation:noclockorrefresh required • Threestateoutputs • Datacontrolforupperandlowerbytes • IndustrialandAutomotivetemperaturesupport • Lead-freeavailable 64K x 16 HIGH SPEED ASYNCHRONOUS CMOS STATIC RAM DESCRIPTION The ISSIIS61WV6416DAxx/DBxxandIS64WV6416DBxx arehigh-speed,1,048,576-bitstaticRAMsorganizedas 65,536wordsby16bits.Itisfabricatedusing ISSI'shigh- performanceCMOStechnology.Thishighlyreliableprocess coupledwithinnovativecircuitdesigntechniques,yields high-performanceandlowpowerconsumptiondevices. When CE is HIGH (deselected), the device assumes a standbymodeatwhichthepowerdissipationcanbere- duceddownwithCMOSinputlevels. EasymemoryexpansionisprovidedbyusingChipEnable andOutputEnableinputs,CEandOE.TheactiveLOW WriteEnable(WE)controlsbothwritingandreadingofthe memory.AdatabyteallowsUpperByte(UB)andLower Byte(LB)access. The IS61WV6416DAxx/DBxx and IS64WV6416DBxx arepackagedintheJEDECstandard44-pinTSOPType II, 44-pin 400-mil SOJand 48-pin Mini BGA (6mm x 8mm). FUNCTIONAL BLOCK DIAGRAM A0-A15 CE OE WE 64K x 16 MEMORY ARRAY DECODER COLUMN I/O CONTROL CIRCUIT GND VDD I/O DATA CIRCUIT I/O0-I/O7 Lower Byte I/O8-I/O15 Upper Byte UB LB JANUARY 2011 |
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