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COMBOSOLAR Datasheet(PDF) 10 Page - Texas Instruments |
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COMBOSOLAR Datasheet(HTML) 10 Page - Texas Instruments |
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10 / 57 page  AFE031 SBOS531D – AUGUST 2010 – REVISED MAY 2012 www.ti.com ELECTRICAL CHARACTERISTICS: Power Supply At TJ = +25°C, PA_VS = 16 V, VAVDD = VDVDD = 3.3 V, and 10 kΩ connected to PA_ISET (pin 46), unless otherwise noted. AFE031 PARAMETER CONDITIONS MIN TYP MAX UNIT Operating Supply Range Power amplifier supply voltage PA_VS +7 +24 V Digital supply voltage DVDD +3.0 +3.6 V Analog supply voltage AVDD +3.0 +3.6 V Quiescent Current SD pin low IO = 0, PA = On (1) 49 61 mA Power amplifier current IQPA_VS IO = 0, PA = Off (2) 10 μA Tx configuration(3) 1.2 mA Digital supply current IQDVDD Rx configuration(4) 5 μA All blocks disabled(5) 5 μA Tx configuration(3) 2.8 3.7 mA Analog supply current IQAVDD Rx configuration(4) 3.6 5.3 mA All blocks disabled(5) 30 μA Shutdown (SD) Power amplifier supply voltage PA_VS SD pin high 75 150 μA Digital supply voltage DVDD SD pin high 5 10 μA Analog supply voltage AVDD SD pin high 15 40 μA Temperature Specified range –40 +125 °C (1) Enable1 Register = 00100011, Enable2 Register = 00001110. (2) Enable1 Register = 00000100, Enable2 Register = 00000110. (3) In the Tx configuration, the following blocks are enabled: DAC, Tx, PA, REF1, and REF2. All other blocks are disabled. Enable1 Register = 00100011, Enable2 Register = 00001110. (4) In the Rx configuration, the following blocks are enabled: Rx, REF1, and REF2. All other blocks are disabled. Enable1 Register = 00000100, Enable2 Register = 00000110. (5) Enable1 Register = 00000000, Enable2 Register = 00000000. THERMAL INFORMATION AFE031 THERMAL METRIC(1) RGZ (QFN) UNITS 48 PINS θJA Junction-to-ambient thermal resistance 27.8 θJCtop Junction-to-case (top) thermal resistance 12.1 θJB Junction-to-board thermal resistance 7.5 °C/W ψJT Junction-to-top characterization parameter 0.4 ψJB Junction-to-board characterization parameter 7.4 θJCbot Junction-to-case (bottom) thermal resistance 1.7 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 10 Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): AFE031 |
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