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KMPC8315CVRAGDA Datasheet(PDF) 99 Page - Freescale Semiconductor, Inc

Part # KMPC8315CVRAGDA
Description  PowerQUICC II Pro Processor Hardware Specifications
PDF  106 Pages
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

KMPC8315CVRAGDA Datasheet(HTML) 99 Page - Freescale Semiconductor, Inc

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MPC8315E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
99
Thermal
Millennium Electronics (MEI)
408-436-8770
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-thermal.com
Tyco Electronics
800-522-6752
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105
Internet: www.tycoelectronics.com
Wakefield Engineering
603-635-2800
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Interface material vendors include the following:
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Corporate Center
PO BOX 994
Midland, MI 48686-0994
Internet: www.dowcorning.com
Shin-Etsu MicroSi, Inc.
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company
800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
25.3
Heat Sink Attachment
When attaching heat sinks to these devices, an interface material is required. The best method is to use
thermal grease and a spring clip. The spring clip should connect to the printed circuit board, either to the
board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces which would
lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint
lifetime of the package. Recommended maximum force on the top of the package is 10 lb force (45
Newtons). If an adhesive attachment is planned, the adhesive should be intended for attachment to painted
or plastic surfaces and its performance verified under the application requirements.



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