PIC17C752-08SLASHP datasheet(225/320 Pages) MICROCHIP

225 / 320 page

Preliminary

DS30264A-page 225

PIC17C75X

20.1 DC CHARACTERISTICS:

PIC17C752/756-25 (Commercial, Industrial)

PIC17C752/756-33 (Commercial, Industrial)

DC CHARACTERISTICS

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40˚C

≤ TA ≤ +85˚C for industrial and

0˚C

≤ TA ≤ +70˚C for commercial

Param.

No.

Sym

Characteristic

Min Typ† Max Units

Conditions

D001

VDD

Supply Voltage

4.5

–

6.0

D002

VDR

RAM Data Retention

Voltage (Note 1)

1.5 *

–

Device in SLEEP mode

D003

VPOR

VDD start voltage to

ensure internal

Power-on Reset signal

–VSS

–

See section on Power-on Reset for

details

D004

SVDD

VDD rise rate to

ensure proper

operation

0.085 *

–

V/ms

See section on Power-on Reset for

details

D005

VBOR

Brown-out Reset

voltage trip point

3.6

–

4.3

D006

VPORTP Power-on reset trip

point

–

1.8

–

VDD = VPORTP

D010

D011

D012

D013

D015

IDD

Supply Current

(Note 2)

–

TBD

6 *

24 *

FOSC = 4 MHz (Note 4)

FOSC = 8 MHz

FOSC = 16 MHz

FOSC = 25 MHz

FOSC = 33 MHz

D021

IPD

Power-down Current

(Note 3)

–< 1

µAVDD = 5.5V, WDT disabled

Module Differential

Current

D023

∆IBOR

BOR circuitry

–

300

500

µAVDD = 4.5V, BODEN enabled

D024

∆IWDT

Watchdog Timer

–

µAVDD = 5.5V

D026

∆IAD

A/D converter

–

µAVDD = 5.5V, A/D not converting

These parameters are characterized but not tested.

†

Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance

only and are not tested.

Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin

loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an

impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD or VSS, T0CKI = VDD,

MCLR = VDD; WDT disabled.

Current consumed from the oscillator and I/O’s driving external capacitive or resistive loads needs to be con-

sidered.

For the RC oscillator, the current through the external pull-up resistor (R) can be estimated as: VDD / (2

• R).

For capacitive loads, the current can be estimated (for an individual I/O pin) as (CL

• VDD) • f

CL = Total capacitive load on the I/O pin; f = average frequency the I/O pin switches.

The capacitive currents are most signiﬁcant when the device is conﬁgured for external execution (includes

extended microcontroller mode).

3: The power down current in SLEEP mode does not depend on the oscillator type. Power-down current is

measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.

4: For RC osc conﬁguration, current through Rext is not included. The current through the resistor can be esti-

mated by the formula IR = VDD/2Rext (mA) with Rext in kOhm.

PIC17C752-08/P Datasheet(PDF) 225 Page - Microchip Technology

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