MCP39F511 datasheet(55/62 Pages) MICROCHIP

Part #	MCP39F511

Description	Power-Monitoring IC with Calculation and Energy Accumulation

PDF	62 Pages

Scroll/Zoom	100%

Manufacturer	MICROCHIP [Microchip Technology]

Direct Link	http://www.microchip.com

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55 / 62 page

 2015 Microchip Technology Inc.

DS20005393B-page 55

MCP39F511

Microchip Technology Drawing C04-140C Sheet 2 of 2

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x0.9 mm Body [QFN]

Dimension Limits

Units

Overall Width

Overall Length

Exposed Pad Length

Exposed Pad Width

Contact Thickness

3.35

MILLIMETERS

0.20 REF

MIN

MAX

5.00 BSC

3.25

Contact Length

Contact Width

0.45

0.30

Notes:

Contact-to-Exposed Pad

0.20

NOM

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Standoff

0.02

Overall Height

0.90

Pitch

0.50 BSC

Number of Pins

N28

0.35

0.18

3.15

0.00

0.80

0.25

0.40

3.25

5.00 BSC

3.35

0.05

1.00

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M.

Package is saw singulated.

MCP39F511 Datasheet(PDF) 55 Page - Microchip Technology

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