(All voltages referenced to GND, unless otherwise noted.)

V24 .........................................................................-70V to +65V

REG..............................................................-0.3V to (V5 + 16V)

V5, VL......................................................................-0.3V to +6V

V33 ..............................................................-0.3V to (V5 + 0.3V)

C/Q, DO, DI.................. MIN: Larger of -70V and (V24 - 70V) to

MAX: the lower of +70V and (V24 + 70V)

Logic Inputs:

CS/PP, TXEN, TX, LED1IN, LI,

UARTSEL, CLK/TXEN/200MA, SPI/PIN,

SDI/TX/NPN ..............................................-0.3V to (VL + 0.3V)

Logic Outputs:

IRQ/OC..................................................................-0.3V to +6V

LED1, LED2 ..................................................-0.3V to (V5+0.3V)

Continuous Current Into GND and V24 ................................±1A

Continuous Current Into C/Q and DO ............................±500mA

Continuous Current Into V5 and REG............................±100mA

Continuous Current Into Any Other Pin............................±50mA

Continuous Power Dissipation

TQFN (derate 27.8mW/°C above +70°C)..................2222mW

WLP (derate 22.7mW/°C above +70°C) ....................1816mW

Operating Temperature Range......................... -40°C to +125°C

Maximum Junction Temperature ......................Internally Limited

Storage Temperature Range............................ -65°C to +150°C

Soldering Temperature (reflow, TQFN and WLP) ...........+260°C

TQFN

WLP

(Note 1)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

V24 Supply Voltage

9

60

V

V24 Undervoltage-Lockout

Threshold

6

7.8

9

V

6

7.2

9

V24 Undervoltage-Lockout-

Threshold Hysteresis

570

mV

V24 Supply Current

V5 powered

externally, REG is

unconnected

C/Q and DO

disabled (CQ_Dis =

1, DO_Dis = 1)

0.14

0.5

mA

C/Q and DO

in push-pull

configuration,

CL[10] = 11, C/Q

and DO high, no

load on C/Q or DO

1.1

1.75

C/Q and DO

in push-pull

configuration,

CL[10] = 11, C/Q

and DO low, no load

on C/Q or DO

1.4

1.8

MAX14827

IO-Link Device Transceiver

www.maximintegrated.com

Maxim Integrated │ 3

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

DC Electrical Characteristics