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ST72325AR7-Auto Datasheet(PDF) 227 Page - STMicroelectronics

Part # ST72325AR7-Auto
Description  SCI asynchronous serial interface
PDF  243 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST72325AR7-Auto Datasheet(HTML) 227 Page - STMicroelectronics

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Obsolete
Product(s)
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Product(s)
ST72325xxx-Auto
Package characteristics
Doc ID 13770 Rev 3
227/243
20.2
Thermal characteristics
20.3
Ecopack information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
20.4
Packaging for automatic handling
The devices can be supplied in trays or with tape and reel conditioning.
Tape and reel conditioning can be ordered with pin 1 left-oriented or right-oriented when
facing the tape sprocket holes as shown in Figure 104.
Figure 104. pin 1 orientation in tape and reel conditioning
See also Figure 105: ST72F325xxx-Auto Flash commercial product structure on page 231
and Figure 106: ST72P325xxx-Auto FastROM commercial product structure on page 232.
Table 143.
Thermal characteristics
Symbol
Ratings
Value
Unit
RthJA
Package thermal resistance (junction to ambient)
LQFP64
14x14
LQFP64
10x10
LQFP44
10x10
LQFP32
7x7
47
50
52
70
°C/W
PD
Power dissipation(1)
1.
The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation
of an application can be defined by the user with the formula: PD =PINT +PPORT where PINT is the chip
internal power (IDD xVDD) and PPORT is the port power dissipation depending on the ports used in the
application.
500
mW
TJmax
Maximum junction temperature(2)
2.
The maximum chip-junction temperature is based on technology characteristics.
150
°C
Right orientation (EIA 481-C compliant)
Left orientation
Pin 1
Pin 1



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