STM8S105C4 datasheet(118/121 Pages) STMICROELECTRONICS

118 / 121 page

Revision history

STM8S105x4/6

118/121

DocID14771 Rev 15

21-Apr-2010

Added UFQFPN32 package silhouette to the title page.

In Features: added unique ID.

Section: Clock controller:

updated bit positions for TIM2

and TIM3.

Section: Beeper:

added information about availability of

the beeper output port through option bit AFR7.

Section: Analog-to-digital converter (ADC1)

: added a

note concerning additional AIN12 analog input.

Section: STM8S105 pinouts and pin description

: added

UFQFPN32 package details; updated default alternate

function of PB2/AIN2[TIM1_CH3N] pin in the "Pin

description for STM8S105 microcontrollers" table.

Section: Option bytes:

added description of STM8L

bootloader option bytes to the option byte description

table.

Added Section: Unique ID

Section: Operating conditions

: added introductory text;

removed low power dissipation condition for TA,

replaced "CEXT" by "VCAP", and added ESR and ESL

data in table "general operating conditions".

Section: Total current consumption in halt mode

replaced max value of IDD(H) at 85 °C from 20 µA to 25

µA for the condition "Flash in powerdown mode, HSI

clock after wakeup in the table "total current

consumption in halt mode at VDD = 5 V.

Section: Low power mode wakeup times

: added first

condition (0 to 16 MHz) for the tWU(WFI) parameter in the

table "wakeup times".

Section: Internal clock sources and timing

characteristics

: In the table: HSI oscillator

characteristics

, replaced min and max values of

ACCHSI factory calibrated parameter and removed

footnote 4 concerning further characterization of results.

Section: Functional EMS (electromagnetic

susceptibility

): IEC 1000 replaced with IEC 61000.

Section: Designing hardened software to avoid noise

problems:

IEC 1000 replaced with IEC 61000.

Section: Electromagnetic interference (EMI)

: SAE J

1752/3 replaced with IEC61967-2.

Section: Thermal characteristics:

Replaced the thermal

resistance junction ambient temperature of LQFP32 7X7

mm from 59 °C to 60 °C in the thermal characteristics

table.

Added Section: 32-lead UFQFPN package mechanical

data.

Added Section STM8S105 FASTROM microcontroller

option list.

Table 57. Document revision history (continued)

Date

Revision

Changes

STM8S105C4 Datasheet(PDF) 118 Page - STMicroelectronics

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