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STM32F383CC Datasheet(PDF) 112 Page - STMicroelectronics |
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STM32F383CC Datasheet(HTML) 112 Page - STMicroelectronics |
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112 / 125 page  Package characteristics STM32F383xx 112/125 DocID023367 Rev 2 Figure 31. WLCSP66 – 0.400 mm pitch wafer level chip size package outline 1. Drawing is not to scale. Bump side Side view Detail A Wafer back side A1 ball location A1 Detail A rotated by 90 °C eee D Seating plane A2 A b E e e1 e G F e2 A0R5_ME_V2 A B C D E F G H I 8 7 6 543 21 A1 ball location Table 72. WLCSP66 – 0.400 mm pitch wafer level chip size package mechanical data Symbol millimeters inches Min Typ Max Min Typ Max A 0.520 0.570 0.600 0.0205 0.0224 0.0236 A1 0.170 0.190 0.210 0.0067 0.0075 0.0083 A2 0.350 0.380 0.410 0.0138 0.0150 0.0161 b 0.245 0.270 0.295 0.0096 0.0106 0.0116 D 3.747 3.767 3.787 0.1475 0.1483 0.1491 E 4.209 4.229 4.249 0.1657 0.1665 0.1673 e - 0.400 - - 0.0157 - e1 - 2.800 - - 0.1102 - e2 - 3.200 - - 0.1260 - F - 0.484 - - 0.0191 - G - 0.515 - - 0.0203 - eee - - 0.050 - - 0.0020 |
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