Package information

STHVDAC-253M

24/27

DocID025735 Rev 1

6

Package information

•

Epoxy meets UL94, V0

•

Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 16. Package dimensions

Figure 17. Footprint

Figure 18. Marking

1.7 mm ± 50 µm

0.2 mm

A1

0.25 mm

250 µm ± 30

400 µm ± 50

600 µm ± 55 µm

220 µm recommended

220 µm recommended

260 µm maximum

Solder stencil opening:

Copper pad diameter:

Solder mask opening:

300 µm minimum

x

y

x

w

z

w

Dot, ST logo

xx = marking

yww = datecode

(y = year

ww = week)

z = packaging location

ECOPAK grade