4

TL7700-SEP

SLVSF13 – MARCH 2019

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Copyright © 2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to the network ground terminal.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

41

V

SENSE input voltage

–0.3

41

V

Output voltage (off state)

41

V

Output current (on state)

5

mA

Operating virtual-junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

500

V

1000

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

Supply voltage

1.8

40

V

Low-level output current

3

mA

Operating free-air temperature

–55

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

6.4 Thermal Information

TL7700-SEP

UNIT

PW (TSSOP)

8 PINS

Junction-to-ambient thermal resistance

172.9

°C/W

Junction-to-case (top) thermal resistance

56.6

°C/W

Junction-to-board thermal resistance

101.2

°C/W

Junction-to-top characterization parameter

5.2

°C/W

Junction-to-board characterization parameter

99.6

°C/W