PCE85176AUGSLASHDA datasheet(38/48 Pages) NXP

38 / 48 page

PCE85176AUG

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Product data sheet

Rev. 1 — 12 January 2015

38 of 48

NXP Semiconductors

PCE85176AUG

4 × 40 LCD segment driver for Chip-On-Glass

[1]

Pressure of diamond head: 10 g to 50 g.

16. Handling information

All input and output pins are protected against ElectroStatic Discharge (ESD) under

normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that

all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent

standards.

17. Packing information

17.1 Tray information for PCE85176AUG

Table 28.

Alignment marks

All x/y coordinates represent the position of the REF point (see Figure 28) with respect to the center

(x/y = 0) of the chip (see Figure 2, and Figure 27).

Symbol

Location

Dimension (

m)

X (

m)

Y (

m)

987.1

778.0

 45

955.4

778.0

 45

Table 29.

Gold bump hardness

Type number

Min

Max

Unit[1]

PCE85176AUG/DA

120

Fig 29. Tray details for PCE85176AUG

PCE85176AUG/DA Datasheet(PDF) 38 Page - NXP Semiconductors

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