PCE85176AUGSLASHDA datasheet(42/48 Pages) NXP

42 / 48 page

PCE85176AUG

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Product data sheet

Rev. 1 — 12 January 2015

42 of 48

NXP Semiconductors

PCE85176AUG

4 × 40 LCD segment driver for Chip-On-Glass

19. Abbreviations

20. References

[1]

AN10170 — Design guidelines for COG modules with NXP monochrome LCD

drivers

[2]

AN10365 — Surface mount reflow soldering description

[3]

AN10439 — Wafer Level Chip Size Package

[4]

AN10706 — Handling bare die

[5]

AN10853 — ESD and EMC sensitivity of IC

[6]

AN11267 — EMC and system level ESD design guidelines for LCD drivers

[7]

IEC 60134 — Rating systems for electronic tubes and valves and analogous

semiconductor devices

[8]

IEC 61340-5 — Protection of electronic devices from electrostatic phenomena

[9]

JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body

Model (HBM)

[10] JESD78 — IC Latch-Up Test

[11] JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive

(ESDS) Devices

[12] R_10015 — Chip-On-Glass (COG) - a cost-effective and reliable technology for

LCD displays

[13] UM10204 — I2C-bus specification and user manual

[14] UM10569 — Store and transport requirements

Table 32.

Abbreviations

Acronym

Description

CMOS

Complementary Metal-Oxide Semiconductor

Direct Current

HBM

Human Body Model

I2C

Inter-Integrated Circuit

Integrated Circuit

LCD

Liquid Crystal Display

LSB

Least Significant Bit

MSB

Most Significant Bit

RAM

Random Access Memory

Resistance and Capacitance

RMS

Root Mean Square

SCL

Serial CLock line

SDA

Serial DAta Line

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