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ST25R3911B Datasheet(PDF) 98 Page - STMicroelectronics |
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ST25R3911B Datasheet(HTML) 98 Page - STMicroelectronics |
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98 / 116 page  3 Electrical characteristics 3.1 Absolute maximum ratings Stresses beyond those listed Table 95, Table 96 and Table 97 may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated in Section 3.2 Operating conditions is not guaranteed. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 95. Electrical parameters Symbol Parameter Min Max Unit Comments VDD DC supply voltage -0.5 6.0 V - VDD_IO DC_IO supply voltage -0.5 6.0 V - VINTRIM Input pin voltage TRIM pins -0.5 25.0 V - VIN Input pin voltage for peripheral communication pins -0.5 6.5 V - VINA Input voltage for analog pins -0.5 6.0 V - Iscr Input current (latch-up immunity) -100 100 mA Norm: JEDEC 78 Ioutmax Drive capability of output driver 0 600 mA - Table 96. Electrostatic discharge Symbol Parameter Min Max Unit Comments ESD Electrostatic discharge ±2 kV Standard JS-001-2014 (Human body model) ±500 V Standard JS-001-2014 (Human body model) Valid for TRIMx_x pins (pins 13 - 20) Table 97. Temperature ranges and storage conditions Symbol Parameter Min Max Unit Comments Tstrg Storage temperature -55 125 °C - Tbody Package body temperature - 260 °C The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices.” The lead finish for Pb-free leaded packages is matte tin (100% Sn). RHNC Relative Humidity non-condensing 5 85 % - MSL Moisture sensitivity level 3 - Represents a maximum floor life time of 168h. ST25R3911B Electrical characteristics DS11793 - Rev 6 page 98/116 |
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