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STM32F303X6 Datasheet(PDF) 113 Page - STMicroelectronics |
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STM32F303X6 Datasheet(HTML) 113 Page - STMicroelectronics |
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113 / 124 page ![]() DS9866 Rev 8 113/124 STM32F303x6/x8 Package information 120 7.5 WLCSP49 package information Figure 44. WLCSP - 49 ball, 3.89x3.74 mm, 0.5 mm pitch, wafer level chip scale, package outline 1. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 2. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 3. Bump position designation per JESD 95-1, SPP-010. B01F_WLCSP49_ME_V1 DETAIL A ROTATED 90 A G 1 7 G F e1 e e D E e2 BOTTOM VIEW A3 A2 FRONT VIEW TOP VIEW A1 BALL LOCATION D E SIDE VIEW A A2 A1 DETAIL A bbb Z aaa SEATING PLANE BUMP A2 |
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