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STM32F303X6 Datasheet(PDF) 114 Page - STMicroelectronics |
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STM32F303X6 Datasheet(HTML) 114 Page - STMicroelectronics |
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114 / 124 page ![]() Package information STM32F303x6/x8 114/124 DS9866 Rev 8 Figure 45. WLCSP - 49 ball, 3.89x3.74 mm, 0.5 mm pitch, wafer level chip scale, recommended footprint 1. Dimensions are expressed in millimeters. Table 74. WLCSP - 49 ball, 3.89x3.74 mm, 0.5 mm pitch, wafer level chip scale, mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A - - 0.62 - - 0.0244 A1 - 0.23 - - 0.009 - A2 - 0.36 - - 0.014 - A3 - 0.025(2) 2. A3 value is guaranteed by technology design value. -- 0.001 - b 0.30 0.33 0.36 0.012 0.013 0.014 D 3.87 3.89 3.91 0.152 0.153 0.154 E 3.72 3.74 3.76 0.146 0.147 0.148 e - 0.50 - - 0.020 - e1 - 3.00 - - 0.118 - e2 - 3.00 - - 0.118 - F - 0.445(3) 3. This value is calculated from over value D and e1. -- 0.017 - G - 0.370(4) 4. This value is calculated from over value E and e2. -- 0.015 - aaa - - 0.10 - - 0.004 bbb - - 0.10 - - 0.004 ccc - - 0.10 - - 0.004 ddd - - 0.05 - - 0.002 eee - - 0.05 - - 0.002 B01F_WLCSP49_FP_V1 Dpad Dsm |
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