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STM32F303X6 Datasheet(PDF) 115 Page - STMicroelectronics |
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STM32F303X6 Datasheet(HTML) 115 Page - STMicroelectronics |
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115 / 124 page ![]() DS9866 Rev 8 115/124 STM32F303x6/x8 Package information 120 Device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 46. WLCSP49 marking example (package top view) 1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST's Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. Table 75. WLCSP - 49 ball, 3.89x3.74 mm, 0.5 mm pitch, wafer level chip scale, recommended PCB design rules Dimension Recommended values Pitch 0.5 mm Dpad 0.290 mm Dsm 0.350 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.310 mm Stencil thickness 0.100 mm |
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