EFP01 datasheet(38/158 Pages) SILABS

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5.1.2 Thermal Characteristics

Table 5.2. Thermal Characteristic

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Thermal impedance, junc-

tion-to-ambient QFN20

(3x3mm)

THETAJA

2 layer PCB, Natural Convection1

—

81.2

—

°C/W

4 layer PCB, Natural Convection1

—

66.0

—

°C/W

Thermal impedance, junc-

tion-to-board QFN20

(3x3mm)

THETAJB

2 layer PCB, Natural Convection1

—

37.9

—

°C/W

4 layer PCB, Natural Convection1

—

°C/W

Thermal impedance, junc-

tion-to-case QFN20 (3x3mm)

THETAJC

2 layer PCB, Natural Convection1

—

46.5

—

°C/W

4 layer PCB, Natural Convection1

—

34.6

—

°C/W

Junction-to-top thermal char-

acterization parameter

QFN20 (3x3mm)

PSIJT

2 layer PCB, Natural Convection1

—

2.6

—

°C/W

4 layer PCB, Natural Convection1

—

1.9

—

°C/W

Junction-to-bottom thermal

characterization parameter

QFN20 (3x3mm)

PSIJB

2 layer PCB, Natural Convection1

—

39.1

—

°C/W

4 layer PCB, Natural Convection1

—

26.7

—

°C/W

Note:

1. Measured according to JEDEC standard JESD51-2A Integrated Circuit Thermal Test Method Environmental Conditions - Natural

Convection (Still Air).

EFP01 Energy Friendly PMIC Family Data Sheet

Electrical Specifications

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