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HC05RC16GRS/D Datasheet(PDF) 118 Page - NXP Semiconductors

Part # HC05RC16GRS/D
Description  General Release Specification
PDF  122 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

HC05RC16GRS/D Datasheet(HTML) 118 Page - NXP Semiconductors

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Ordering Information
General Release Specification
MC68HC05RC16 — Rev. 3.0
Ordering Information
13.6 ROM Verification Units (RVUs)
After receiving the signed listing verify form, Motorola manufactures a
custom photographic mask. The mask contains the customer’s
application program and is used to process silicon wafers. The
application program cannot be changed after the manufacture of the
mask begins. Motorola then produces 10 MCUs, called RVUs, and
sends the RVUs to the customer. RVUs are usually packaged in
unmarked ceramic and tested to 5 Vdc at room temperature. RVUs are
not tested to environmental extremes because their sole purpose is to
demonstrate that the customer’s user ROM pattern was properly
implemented. The 10 RVUs are free of charge with the minimum order
quantity. These units are not to be used for qualification or production.
RVUs are not guaranteed by Motorola Quality Assurance.
13.7 MC Order Numbers
Table 13-1 provides information in determing order numbers.
Table 13-1. MC Order Numbers
Package Type
Operating
Temperature
Range
MC Order Number
28-Pin Plastic Dual In-Line
Package (DIP)
0 to 70
°C
MC68HC05RC8P
MC68HC05RC16P
28-Pin Small Outline Integrated Circuit
Package (SOIC)
0 to 70
°C
MC68HC05RC8DW
MC68HC05RC16DW
44-Pin Plastic Leaded Chip
Carrier (PLCC)
0 to 70
°C
MC68HC05RC8FN
MC68HC05RC16FN
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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