STM32H7 datasheet(350/357 Pages) STMICROELECTRONICS

350 / 357 page

Revision history

STM32H742xI/G STM32H743xI/G

350/357

DS12110 Rev 10

Revision history

Table 231. Document revision history

Date

Revision

Changes

22-Jun-2017

Initial release.

27-Sep-2017

Updated list of features. Changed datasheet status to “production data”.

Added UFBGA169 and TFBGA100 packages and well as notes related their status on

cover page and in Table 2: STM32H742xI/G and STM32H743xI/G features and

peripheral counts. Differentiated number of GPIOs for each package in Table 2:

STM32H742xI/G and STM32H743xI/G features and peripheral counts.

Updated Error code correction (ECC) in Section 3.3.2: Embedded SRAM. Change

PWR_CR3 into PWR_D3CR in Section 3.5.1: Power supply scheme. Updated

Section 3.12: Nested vectored interrupt controller (NVIC).

Added ADC sampling rate values in Section 3.17: Analog-to-digital converters (ADCs).

Added Table 4: DFSDM implementation in Section 3.23: Digital filter for sigma-delta

modulators (DFSDM)

Changed PC2/3 to PC2/3_C and VDD33USB to VDD in Figure 5: LQFP100 pinout.

Changed PC2/3 to PC2/3_C in Figure 7: LQFP144 pinout. Changed PC2/3 to PC2/3_C

in Figure 9: LQFP176 pinout. Changed PC2/3 to PC2/3_C in Figure 11: LQFP208

pinout.

Table 9: Pin/ball definition:

– Modified PA7, PC4, PC5, PB1, PG1, PE7, PE8 and PE9 I/O structure

– TFBGA240 +25: removed duplicate occurrence of F1, F2 and P17 pin; added notes

related to F1, F2, G2 pin connection; added note on E1, L16, L17, M16, M17, K16,

K17, N17.

– UFBGA176+25: changed G10 pin name to VSS.

– Added note to VREF+ pin.

Added current consumption corresponding to 125 °C ambient temperature in

Section 6.3.6: Supply current characteristics. Removed CRYP peripheral from Table 39:

Peripheral current consumption in Run mode.

Replaced FMC_CLK by FMC_SDCLK in Section : SDRAM waveforms and timings.

Changed description of the last five fS values and updated tLATRINJin Table 87: ADC

characteristics.

For TFBGA100, TFBGA240+25 and UFBGA169, updated thermal resistance power-

junction in Table 230: Thermal characteristics as well as power dissipation in Table 24:

General operating conditions.

23-Oct-2017

Features:

– Removed secure firmware upgrade support.

– Total current consumption changed to 4 µA minimum.

Updated Figure 8: UFBGA169 ballout.

Updated dpad and dsm in Table 136: TFBGA240+25 - Recommended PCB design

rules.

STM32H7 Datasheet(PDF) 350 Page - STMicroelectronics

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