STM32H7 datasheet(354/357 Pages) STMICROELECTRONICS

354 / 357 page

Revision history

STM32H742xI/G STM32H743xI/G

354/357

DS12110 Rev 10

13-Apr-2021

(continued)

Section 7: Electrical characteristics (rev V):

– Updated Section 7.2: Absolute maximum ratings introduction to device mission

profile.

– Added a 1 μF capacitor between VDD33USB and ground in Figure 68: Power supply

scheme.

– Power dissipation (PD) removed from Table 122: General operating conditions since

this parameter is redundant with

ΘJA thermal resistance.

– Replaced Min VDD by Min VDDLDO in Table 123: Supply voltage and maximum

frequency configuration.

– Table 150: Flash memory programming: removed reference to single bank

configuration in title and added tERASE128KB typical and maximum values.

– Updated condition related to

frcc_c_ck in Section : On-chip peripheral current

consumption.

– Added reference to AN4899 in Section 7.3.15: I/O port characteristics. Changed

capacitance value for speed 10 and tr/tf, and speed for 11 and tr/tf/Fmax Table 161:

Output timing characteristics (HSLV ON).

– Updated tsu(DV-CLKH)/th(DV-CLKH) and tsu(NWAIT-CLKH)/th(NWAIT-CLKH) in Table 171:

Synchronous multiplexed NOR/PSRAM read timings. Changed t(NWAIT-CLKH) to

tsu(NWAIT-CLKH) and updated tsu(DV-CLKH)/th(DV-CLKH) and tsu(NWAIT-CLKH)/th(NWAIT-CLKH)

in Table 173: Synchronous non-multiplexed NOR/PSRAM read timings. Updated

tsu(SDCLKH _Data) and th(SDCLKH _Data) in Table 177: SDRAM read timings and

Table 178: LPSDR SDRAM read timings.

– Updated ts(IN) and th(IN) in Table 181: QUADSPI characteristics in SDR mode and

tsr(IN)/tsf(IN) and thr(IN)/thf(IN) in Table 182: QUADSPI characteristics in DDR mode.

– Updated notes 4. and 5. in Table 185: Minimum sampling time vs RAIN. Added

reference to AN5354 application note in note of Table 184: ADC characteristics.

Specified that Figure 40: ADC accuracy characteristics is an example for 12-bit

resolution.

– Changed temperature condition to 130 °C for TS_CAL2 in Table 191: Temperature

sensor calibration values.

– Updated DuCyCKOUT in Table 198: DFSDM measured timing - 1.62-3.6 V.

– Updated Figure 101: USART timing diagram in Master mode and Figure 102: USART

timing diagram in Slave mode.

– Updated tsu(MI) and th(MI) in Table 205: SPI dynamic characteristics.

– Updated tISU, tIH, tISUDand tIHD in Table 209: Dynamics characteristics: SD / MMC

characteristics, VDD = 2.7 to 3.6 V

Updated tISU, tIH in Table 210: Dynamics characteristics: eMMC characteristics

VDD = 1.71V to 1.9V.

Added ΘJB and ΘJC for UFBGA169.

Updated Figure 124: TFBGA100 - Recommended footprint

Added Figure 151: UFBGA169 - Recommended footprint and Table 304: UFBGA169 -

Recommended PCB design rules (0.5 mm pitch BGA).

Updated Section 8.8: UFBGA(176+25) package information.

Added note related to the availability of tape and reel packing in Section 9: Ordering

information.

Table 231. Document revision history

Date

Revision

Changes

STM32H7 Datasheet(PDF) 354 Page - STMicroelectronics

STM32H7 Datasheet(HTML) 354 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL