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STM32H7 Datasheet(PDF) 351 Page - STMicroelectronics

Part # STM32H7
Description  32-bit Arm® Cortex®-M7 480MHz MCUs, up to 2MB flash, up to 1MB RAM, 46 com. and analog interfaces
PDF  357 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32H7 Datasheet(HTML) 351 Page - STMicroelectronics

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DS12110 Rev 10
351/357
STM32H742xI/G STM32H743xI/G
Revision history
356
18-May-2018
4
Updated LSI clock frequency and ADC on cover page. Removed note related to
UFBGA169 package.
Updated USB OTG interfaces to add crystal-less capability.
Updated ADC features on cover page and in Table 2: STM32H742xI/G and
STM32H743xI/G features and peripheral counts.
Added Arm trademark notice in Section 1: Introduction.
Updated Figure 1: STM32H743xI/G block diagram.
Updated GPIO default mode in Section 3.8: General-purpose input/outputs (GPIOs).
Added ADC sampling rate values in Section 3.17: Analog-to-digital converters (ADCs).
Updated Section 3.18: Temperature sensor.
Updated LCD-TFT FIFO Size in Section 3.25: LCD-TFT controller.
Section 3.33: Serial peripheral interfaces (SPI)/integrated interchip sound interfaces
(I2S): changed maximum SPI frequency to 150 Mbits/s.
Modified number of bidirectional endpoints in Section 3.40: Universal serial bus on-the-
go high-speed (OTG_HS).
Table 9: Pin/ball definition: updated PC14 and PC15 function after reset; changed
CAN1_TX/RX to FDCAN1_TX/RX and CAN1_TXFD/RXFD to
FDCAN1_TXFD_MODE/RXFD_MODE; changed CAN2_TX/RX to FDCAN2_TX/RX
and CAN2_TXFD/RXFD to FDCAN2_TXFD_MODE/RXFD_MODE and replaced
VCAP1/2/3 and VDDLDO1/2/3 by VCAP and VDDLDO, respectively.
Updated PA0, PA13, PA14, PC14 and PC15 pin/ball signals in pinout/ballout
schematics.
Replaced fACLK by frcc_c_ck in Section : Typical and maximum current consumption.
Replaced system clock by CPU clock and fACLK by frcc_c_ck in Section : On-chip
peripheral current consumption.
Updated Note 2. in Table 27: Reset and power control block characteristics, Table 28:
Embedded reference voltage, Table 30: Typical and maximum current consumption in
Run mode, code with data processing running from ITCM, regulator ON, Table 31:
Typical and maximum current consumption in Run mode, code with data processing
running from flash memory, cache ON, regulator ON, Table 36: Typical and maximum
current consumption in Stop mode, regulator ON, Table 37: Typical and maximum
current consumption in Standby mode and Table 38: Typical and maximum current
consumption in VBAT mode.
Added note to fLSI in Table 49: LSI oscillator characteristics.
Updated Figure 22: VIL/VIH for all I/Os except BOOT0.
Added note in Table 84: QUADSPI characteristics in SDR mode, Table 85: QUADSPI
characteristics in DDR mode and Table 86: Dynamics characteristics: Delay Block
characteristics.
Section 6.3.20: 16-bit ADC characteristics: updated THD conditions in Table 88: ADC
accuracy; removed formula to compute RAIN.
Changed decoupling capacitor value to 100 nF in Section : General PCB design
guidelines.
Added note in Table 89: DAC characteristics, Table 97: Voltage booster for analog
switch characteristics, Table 100: DFSDM measured timing - 1.62-3.6 V, Table 117:
Dynamics JTAG characteristics and Table 118: Dynamics SWD characteristics.
Updated Figure 128: LQFP144 marking example (package top view), Figure 134:
LQFP176 marking example (package top view) and Figure 137: LQFP208 marking
example (package top view).
Updated TFBGA240+25 package information to final mechanical data.
Table 231. Document revision history
Date
Revision
Changes



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