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CSG14K_CSG8K Datasheet(PDF) 111 Page - ams AG |
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CSG14K_CSG8K Datasheet(HTML) 111 Page - ams AG |
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111 / 113 page  Document Feedback CSG14K_CSG8K Soldering & Storage Information Datasheet • PUBLIC DS000571 • v1-00 • 2020-Dec-15 112 │ 110 10 Soldering & Storage Information Figure 137: Solder Reflow Profile Graph Figure 138: Solder Reflow Profile (1) Parameter Reference Device Average temperature gradient in preheating 2.5 °C/s Soak time tsoak 2 to 3 minutes Time above 217 °C (T1) t1 Max 60 s Time above 230 °C (T2) t2 Max 50 s Time above Tpeak – 10 °C (T3) t3 Max 10 s Peak temperature in reflow Tpeak 245 °C Temperature gradient in cooling Max −5 °C/s (1) The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices.” The lead finish for Pb- free leaded packages is “Matte Tin” (100 % Sn) |
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