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M58LT256JST Datasheet(PDF) 70 Page - STMicroelectronics |
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M58LT256JST Datasheet(HTML) 70 Page - STMicroelectronics |
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70 / 106 page ![]() Part numbering M58LT256JST, M58LT256JSB 70/106 14 Part numbering Devices are shipped from the factory with the memory content bits erased to ’1’. For a list of available options (Speed, Package, etc.) or for further information on any aspect of this device, please contact the ST Sales Office nearest to you. Table 28. Ordering information scheme Example: M58LT256JST 8 ZA 6 E Device Type M58 Architecture L = Multilevel, Multiple Bank, Burst Mode Operating Voltage T = VDD = 1.7 V to 2.0 V, VDDQ = 2.7 V to 3.6 V Density 256 = 256 Mbit (× 16) Technology J = 90 nm technology, Multilevel design Security S = Secure Parameter Location T = Top Boot B = Bottom Boot Speed 8 = 85 ns Package ZA = TBGA64, 10 × 13 mm, 1 mm pitch Temperature Range 6 = –40 to 85 °C Packing Option E = ECOPACK® Package, Standard Packing F = ECOPACK® Package, Tape & Reel Packing T = Tape & Reel Packing Blank = Standard packing |
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