MCP6C26 datasheet(27/37 Pages) MICROCHIP

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DS20006928A-page 29

MCP6C26

Figure 5-6 gives recommended RISO values for

different capacitive loads and gains. The x-axis is the

normalized (by 50/GDM) load capacitance (CL).

After selecting RISO for the circuit, double check the

resulting frequency response peaking and step

response overshoot on the bench. Modify RISO’s value

until the response is reasonable.

FIGURE 5-6:

Recommended RISO vs.

Capacitive Load.

5.1.9

UNIDIRECTIONAL APPLICATIONS

In unidirectional applications where VREF =VSS, it is

important to minimize output headroom (VOL). The

lower VOL is, the more accurate the zero scale reading

is. This is done by making RL high and by tying VL to

VSS.

In unidirectional applications where VREF =VDD, it is

important to minimize output headroom (VDD –VOH).

The higher VOH is, the more accurate the zero scale

reading is. This is done by making RL high and by tying

VL to VDD.

Figure 5-3 shows how to connect VREF and VSS for

best performance.

5.1.10

BIDIRECTIONAL APPLICATIONS

To maximize headroom, reduce VOL and VOH by

setting RL high and by setting VL to mid-supply.

5.1.11

SUPPLY PINS

See Section 3.4, Low-Side Power Supplies (VDD,

VSS)

for

common

power

supply

design

approaches.

Setting VSS = GND has the potential to increase

rejection of crosstalk and glitches. In any case, a good

ground design (e.g., ground plane on a PCB) and

appropriate bypass capacitors are needed to realize

these benefits. It pays to be sure that your capacitor's

voltage rating and dielectric will support your needs

over your voltage and temperature ranges. With some

dielectrics, it pays to also take aging (changes over

time) into account too.

5.1.12

PCB TIPS

These amplifiers are specified up to 36V at the VIP pin

and the load currents can be high. For these reasons,

the PCB design needs to be done with care.

Industry

standards,

such

IPC-2221A,

give

requirements for many PCB related topics. These

topics include current capacity of traces, spacing

between conductors, altitude effects, coatings and

parasitic impedances.

A package's pin spacing, together with other design

choices, affects the maximum voltage allowed between

adjacent pins.

5.1.13

OTHER APPLICATIONS

Other applications not related to high-side current

sensing that the MCP6C26 can be used for are:

• Low-side current sensing

• Differential sensor conditioning.

500

1000

1500

2000

2500

1.00E-11

1.00E-10

1.00E-09

Normalized Capacitive Load; C

L*50/GDM (F)

Gain = 50

Gain = 100

Gain = 200

10p

100p

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