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PPC440GP-3CC466C Datasheet(PDF) 59 Page - Applied Micro Circuits Corporation |
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PPC440GP-3CC466C Datasheet(HTML) 59 Page - Applied Micro Circuits Corporation |
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59 / 83 page ![]() 440GP – Power PC 440GP Embedded Processor AMCC 59 Revision 1.07 – October 4, 2007 Data Sheet Case Temperature rating for C package TC -40 +85 °C6 Case Temperature rating E for C package TC -40 +105 °C6 Case Temperature rating E for F package TC -40 +100 °C6 Notes: 1. PCI-X drivers meet PCI-X specifications. 2. SVREF = SVDD/2 3. The analog voltages used for the on-chip PLLs can be derived from the logic voltage, but must be filtered before entering the PPC440GP. See “Absolute Maximum Ratings” on page 55. 4. During chip power-up, OVDD should begin to ramp before VDD. External voltage should not be applied to the chip I/O pins before OVDD is applied to the chip. A power-down cycle should complete (OVDD and VDD should both be below 0.4V) before a new power- up cycle is started. 5. LPDL is least positive down level; MPUL is most positive up level. 6. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board. Input Capacitance Parameter Symbol Maximum Unit Notes Group 1 (2.5V SSTL I/O) CIN1 12 pF Group 2 (5V tolerant LVTTL I/O) CIN2 12 pF Group 3 (PCI-X I/O) CIN3 12 pF Group 4 (Receivers) CIN4 9pF DC Power Supply Loads Parameter Symbol Minimum Typical Maximum Unit Notes VDD (1.8V) active operating current IDD 915 mA 2 OVDD (3.3V) active operating current IODD 125 mA 2 SVDD (2.5V) active operating current ISDD 560 mA 2 AxVDD (1.8 V) input current IADD 33 mA 1, 2 Notes: 1. See “Absolute Maximum Ratings” on page 55 for filter recommendations. 2. The current values listed above are not guaranteed to be the highest obtainable. These values are dependent on many factors including the type of applications running, clock rates, use of internal functional capabilities, external interface usage, case temperature, and the power supply voltages. Your specific application can produce significantly different results. VDD (logic) current and power are primarily dependent on the applications running and the use of internal chip functions (DMA, PCI, Ethernet, and so on). OVDD (I/O) current and power are primarily dependent on the capacitive loading, frequency, and utilization of the external buses. Recommended DC Operating Conditions (Continued) Device operation beyond the conditions specified is not recommended. Extended operation beyond the recommended conditions can affect device reliability. Parameter Symbol Minimum Typical Maximum Unit Notes |
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