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PPC440GP-3CC466C Datasheet(PDF) 59 Page - Applied Micro Circuits Corporation

Part # PPC440GP-3CC466C
Description  Power PC 440GP Embedded Processor
PDF  83 Pages
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Manufacturer  AMCC [Applied Micro Circuits Corporation]
Direct Link  http://www.amcc.com
Logo AMCC - Applied Micro Circuits Corporation

PPC440GP-3CC466C Datasheet(HTML) 59 Page - Applied Micro Circuits Corporation

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440GP – Power PC 440GP Embedded Processor
AMCC
59
Revision 1.07 – October 4, 2007
Data Sheet
Case Temperature rating for C package
TC
-40
+85
°C6
Case Temperature rating E for C package
TC
-40
+105
°C6
Case Temperature rating E for F package
TC
-40
+100
°C6
Notes:
1. PCI-X drivers meet PCI-X specifications.
2. SVREF = SVDD/2
3. The analog voltages used for the on-chip PLLs can be derived from the logic voltage, but must be filtered before entering the
PPC440GP. See “Absolute Maximum Ratings” on page 55.
4. During chip power-up, OVDD should begin to ramp before VDD. External voltage should not be applied to the chip I/O pins before
OVDD is applied to the chip. A power-down cycle should complete (OVDD and VDD should both be below 0.4V) before a new power-
up cycle is started.
5. LPDL is least positive down level; MPUL is most positive up level.
6. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
Input Capacitance
Parameter
Symbol
Maximum
Unit
Notes
Group 1 (2.5V SSTL I/O)
CIN1
12
pF
Group 2 (5V tolerant LVTTL I/O)
CIN2
12
pF
Group 3 (PCI-X I/O)
CIN3
12
pF
Group 4 (Receivers)
CIN4
9pF
DC Power Supply Loads
Parameter
Symbol
Minimum
Typical
Maximum
Unit
Notes
VDD (1.8V) active operating current
IDD
915
mA
2
OVDD (3.3V) active operating current
IODD
125
mA
2
SVDD (2.5V) active operating current
ISDD
560
mA
2
AxVDD (1.8 V) input current
IADD
33
mA
1, 2
Notes:
1. See “Absolute Maximum Ratings” on page 55 for filter recommendations.
2. The current values listed above are not guaranteed to be the highest obtainable. These values are dependent on many factors including
the type of applications running, clock rates, use of internal functional capabilities, external interface usage, case temperature, and the
power supply voltages. Your specific application can produce significantly different results. VDD (logic) current and power are primarily
dependent on the applications running and the use of internal chip functions (DMA, PCI, Ethernet, and so on). OVDD (I/O) current and
power are primarily dependent on the capacitive loading, frequency, and utilization of the external buses.
Recommended DC Operating Conditions (Continued)
Device operation beyond the conditions specified is not recommended. Extended operation beyond the recommended
conditions can affect device reliability.
Parameter
Symbol
Minimum
Typical
Maximum
Unit
Notes



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