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HYS72T512341HKP Datasheet(PDF) 4 Page - Qimonda AG |
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HYS72T512341HKP Datasheet(HTML) 4 Page - Qimonda AG |
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4 / 32 page ![]() Internet Data Sheet Rev. 1.0, 2006-12 4 11032006-VX0M-M6IH HYS72T512341H[H/J/K]P-[3.7/5]-B Registered DDR2 SDRAM Modules 1.2 Description The Qimonda HYS72T512341H[H/J/K]P–[3.7/5]–B module family are Very Low Profile Registered DIMM (with parity) modules with 18,3 mm height based on DDR2 technology. DIMMs are available as ECC modules in 512M ×72 (4 GB) organization and density, intended for mounting into 240-Ball connector sockets. The memory array is designed with 512-Mbit Double-Data- Rate-Two (DDR2) Synchronous DRAMs. All control and address signals are re-driven on the DIMM using register devices and a PLL for the clock distribution. This reduces capacitive loading to the system bus, but adds one cycle to the SDRAM timing. Decoupling capacitors are mounted on the PCB board. The DIMMs feature serial presence detect based on a serial E2PROM device using the 2-ball I2C protocol. The first 128 bytes are programmed with configuration data and the second 128 bytes are available to the customer. TABLE 2 Ordering Information for RoHS Compliant Products TABLE 3 Address Format TABLE 4 Components on Modules Product Type1) 1) All Product Type numbers end with a place code, designating the silicon die revision. Example: HYS72T512341HJP-3.7-B, indicating Rev. “B” dies are used for DDR2 SDRAM components. For all Qimonda DDR2 module and component nomenclature see Chapter 6 of this data sheet. Compliance Code2) 2) The Compliance Code is printed on the module label and describes the speed grade, for example “PC2–4200P–444–12”, where 4200P means Registered DIMM modules (Parity bit) with 4.26 GB/sec Module Bandwidth and “444-12” means Column Address Strobe (CAS) latency = 4, Row Column Delay (RCD) latency = 4 and Row Precharge (RP) latency = 4 using the latest JEDEC SPD Revision 1.2. Description SDRAM Technology PC2–4200 HYS72T512341HHP–3.7–B 4 GB 4R ×4 PC2–4200P–444–12–ZZ 4 Rank ECC 4 GB ( ×4) HYS72T512341HJP–3.7–B 4 GB 4R ×4 PC2–4200P–444–12–ZZ 4 Rank ECC 4 GB ( ×4) HYS72T512341HKP–3.7–B 4 GB 4R ×4 PC2–4200P–444–12–ZZ 4 Rank ECC 4 GB ( ×4) PC2–3200 HYS72T512341HHP–5–B 4 GB 4R ×4 PC2–3200P–333–12–ZZ 4 Rank ECC 4 GB ( ×4) HYS72T512341HJP–5–B 4 GB 4R ×4 PC2–3200P–333–12–ZZ 4 Rank ECC 4 GB ( ×4) HYS72T512341HKP–5–B 4 GB 4R ×4 PC2–3200P–333–12–ZZ 4 Rank ECC 4 GB ( ×4) DIMM Density Module Organization Memory Ranks ECC/ Non-ECC # of SDRAMs # of row/bank/column bits 4 GB 512M ×72 4 ECC 18 ×4 14/2/11 Product Type DRAM Components DRAM Density DRAM Organisation Note HYS72T512341HHP HYB18T2G401BHF 512 Mbit 512M ×4 1) 1) For a detailed description of all functionalities of the DRAM components on these modules see the component data sheet. HYS72T512341HJP HYS72T512341HKP |
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