www.ti.com

EXAMPLE STENCIL DESIGN

(

6.08)

BASED ON 0.125

THICK STENCIL

60X (0.5)

64X (1.5)

64X (0.3)

(R0.05) TYP

(11.4)

(11.4)

PowerPAD

TQFP - 1.2 mm max height

PAP0064E

PLASTIC QUAD FLATPACK

4228332/A 01/2022

5.14 X 5.14

0.175

5.55 X 5.55

0.15

6.08 X 6.08 (SHOWN)

0.125

6.80 X 6.80

0.1

SOLDER STENCIL

OPENING

STENCIL

THICKNESS

NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

12. Board assembly site may have different recommendations for stencil design.

TM

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED SOLDER COVERAGE BY AREA

SCALE:6X

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES

SYMM

SYMM

BY SOLDER MASK

METAL COVERED

64

49

17

32

33

48

1

16

65